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AMD FirePro W8100 Hawaii GL40
General Information
Manufacturer:
TSMC
Release Date:
6/22/2014
Process Node(nm):
28
Core Count:
-
Total Transistor Count:
6200
Package size (mm²):
-
Die size (mm²):
438
Number of Dies:
-
Transistor density:
14.16
Voltage (low):
-
Voltage (high):
-
Platform:
Processors
GPU: AMD FirePro W8100
General Information
Variant:
Hawaii GL40
TDP (W):
220
Cores:
-
Architecture Information
Architecture:
GCN 2.0
Generation:
FirePro (Wx100)
Process Size (nm):
28
Clock Information
Base Clock (MHz):
-
Boost Clock (MHz):
-
Memory Clock (MHz):
1250
Cache Information
L0 Cache (KB):
-
L1 Cache (KB):
16
L2 Cache (KB):
1024
L3 Cache (KB):
-
Memory Information
Memory Size (GB):
8192
Memory Type:
GDDR5
Memory Bus (bits):
512
Memory Bandwidth (GB/s):
320
Compute Information
Texture Rate (GTexel/s):
-
FP16 Performance (GFLOPS):
-
FP32 Performance (GFLOPS):
4219
FP64 Performance (GFLOPS):
2109
Shader Units (SU):
2560
Texture Mapping Units (TMUs):
160
Render Output Units (ROPs):
64
Graphic API Information
Pixel Rate (GPixel/s):
52.74
Slot:
Dual-slot
DirectX:
12 (12_0)
OpenGL:
4.6
OpenCL:
2
Vulkan:
1.2
Pixel Shader:
-
Vertex Shader:
-
Benchmarks
Benchmark Name
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Economic Data
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